產品與市場
SH260
特點
● Tg＞250℃ (TMA), Td＞405℃ (5% loss, TGA), T300＞60min● 極低Z-熱膨脹系數[1.20% (50-260℃)]，優異的通孔可靠性
● 高的高溫模量保持率和高溫可靠性
● 韌性樹脂體系，不含MDA
● 無鉛無鹵兼容，符合RoHS/WEEE要求
● 符合IPC 4101D/40/41要求
應用領域
● 老化篩選板
● 井下鉆探
● 航空航天
● 其他有長期高溫環境需求的PCB
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24 | TMA | ℃ | ＞250 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 429 |
| T300 |
2.4.24.1 |
TMA |
min |
＞60 |
| CTE (Z-axis) | 2.4.24 | 50-260℃ (X/Y) | ppm/℃ | 12~15 |
| α1 (before Tg) | ppm/℃ | 45 | ||
| 50-260℃ | % | 1.20 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.12 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.007 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.45 x 107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 4.79 x 107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 40.5 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm | 1.37 |
| Flexural Strength | 2.4.4 | A | MPa | 530 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
HB |
Remarks:
1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.